The addition of internet connectivity has become a key ingredient of a new generation of “smart products,” i.e., devices that combine sensing, processing, and communications capabilities with internet-based services and applications. The world’s leading businesses are rushing to offer these smart IoT products to gain an edge over the competition.
Because of this, the total available market for IoT devices is expected to double during the next three years, rising to about 1.6 billion units in 2019, up from 800 million in 2016, according to a forecast compiled by Cypress Semiconductor Corp.
To accelerate their time-to-market, companies are turning to IoT kits, if you will, toprovide the essential building blocks required for IoT development efforts.
Today, Arrow Electronics has introduced two new kit solutions, both complete with its own powerful set of tools designed to streamline the process of evaluating, prototyping, and going into production with new IoT device designs.
The Arrow Quadro IoT Wi-Fi Kit is based on a two-level solution, with each level composed of two types of wireless modules. The modules in the kit are dubbed the PCBM-1GC, the PCBM-1GC-IMP005, the Shield SH-PCBM 1GC, and the Shield SH-PCBM-1GC-IMP005.
All of these modules are specifically tailored to meet the requirements of the IoT world with their combination of wireless and wired communications, processing capabilities, and cloud-based application technology.
Additionally, the various modules are designed to accommodate developers at all skill levels, from hobbyists to enterprise engineers. With their easy-to-use form factors.
THE QUADRO IOT WI-FI KIT:
A look inside the kit modules:
The PCBM-1GC, referred to as 1GC, and PCBM-1GC-IMP005, shortened to 1GC-IMP, feature a small-form-factor printed circuit board (PCB) with dimensions of just 18x 30 mm. Both versions are based on CYW43907, a new, high-performance chipset from Cypress Semiconductor, incorporated in the 1GC and 1GC-IMP005 modules from Murata. The CYW43907 is a highly integrated device, comprising a large number of functions required for embedded applications. This helps to simplify designs and drive
down the costs of producing high-volume IoT products.
The CYW43907 integrates an ARM® Cortex® R4-based applications processor optimized for low-cost and minimal power consumption. The 32-bit Cortex provides a combination of horsepower and efficiency that makes it suitable for a wide range of IoT applications. The 2MB of on chip RAM provides embedded SW developers with ample room to support user applications, cloud connectivity, and ever changing ecosystem specifications such as Apple Homekit. And with support for Ethernet, one can easily
bridge the divide from legacy wired networks to secure wireless connections to the cloud.
The chipset also incorporates a single-stream IEEE 802.11n MAC/baseband/radio, a dual-band 5-GHz and 2.4-GHz transmit power amplifier (PA), and a receive low-noise amplifier (LNA). These components provide receiver and transmit paths for the Wi-Fi wireless local area networks used with IoT devices.
With the 2.4-GHz band becoming increasingly crowded with signals from IoT devices, the dual-band connectivity allows products to switch to the less-congested 5-GHz band. A dual-band WLAN ceramic antenna located on the 1GC module also supports this capability.
Furthermore, the CYW43907 supports optional antenna diversity, allowing improved radio frequency (RF) performance in difficult environments that IoT products might encounter in the field; worth noting, though, is the 1GC-IMP module contains a single antenna only to reduce board space.
Both the 1GC and 1GC-IMP are designed for mounting on a custom PCB to easily add powerful IoT capabilities to a product concept. The modules include two types of solder pads: external edges and bottom balls, providing all of the connections needed for any design.